- Semiconductor Packaging Test Handler System
An advanced final test (FT) handler for MEMS sensors and Memory/MCU:
JEDEC tray-compatible material handling
Array-type pick-and-place with 64 independently controlled nozzles
Nitrogen-free programmable tri-temperature system (±0.5°C precision)
Modular test stimulation chambers for sensor calibration
Mass production-proven performance with 40000+ UPH efficiency
- Application
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MEMS Pressure Sensor
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MEMS Temperature Sensor
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MEMS Gyroscope / Accelerometer Sensor
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Storage Chip
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Power Chip
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